Home » Japan Travel News » Japan Joins Singapore and South Korea Startups Receive Mentorship and Tools to Scale Edge AI Solutions Through Qualcomm QAIPI 2026 Published on
February 3, 2026Japan, Singapore and South Korea startups receive mentorship and tools to scale edge AI solutions through Qualcomm QAIPI 2026 as the regional program empowers emerging technology companies to transform innovative concepts into commercially ready products. By providing access to advanced Qualcomm Dragonwing and Snapdragon platforms along with the new Arduino UNO Q development board, the initiative enables startups to develop real world intelligent applications across sectors including healthcare smart cities industrial IoT consumer devices and education. Participants gain technical guidance mentorship funding and exposure to global innovation ecosystems, accelerating their journey from prototype to market deployment and strengthening the Asia Pacific edge AI landscape.The second edition of the program highlights Qualcomm’s dedication to advancing edge AI, a technology that processes intelligence closer to devices and sensors rather than relying solely on centralized cloud systems. By bringing computation to the edge, the approach enables faster decision making, lower energy consumption, stronger data privacy, and more responsive AI systems. This capability is particularly valuable across sectors such as healthcare, smart cities, industrial automation, consumer electronics, and education, where real time analysis and on site intelligence are crucial.Participating startups are invited to develop AI solutions using Qualcomm Dragonwing and Snapdragon platforms, complemented by the newly launched Arduino UNO Q development board. This combination equips startups with the flexibility to build, test, and scale real world edge AI applications efficiently. From smart medical devices to connected manufacturing equipment and intelligent urban infrastructure, the program supports a wide array of end to end AI projects designed to deliver tangible …
